Texas Instruments Unveils IsoShield-Based Power Modules

Texas Instruments (TI) has introduced a new range of isolated power modules designed to deliver higher power density, improved efficiency, and enhanced safety across applications such as electric vehicles (EVs), data centres, and industrial systems.

The newly launched UCC34141-Q1 and UCC33420 modules leverage TI’s proprietary IsoShield technology—a multichip packaging innovation that enables up to three times higher power density compared to traditional discrete solutions. The technology integrates a high-performance planar transformer with an isolated power stage, offering functional, basic, and reinforced isolation in a compact footprint.

According to Mr. Kannan Soundarapandian, Vice President and General Manager of High Voltage Products at TI, the new packaging approach addresses key industry demands for smaller, more efficient, and reliable solutions, while also accelerating time to market for engineers.

The IsoShield-based modules enable a distributed power architecture, reducing the risk of single-point failures and supporting functional safety requirements. TI claims the technology can shrink solution size by up to 70% while delivering up to 2W of power, making it suitable for space-constrained, high-performance applications.

The development comes at a time when power density is becoming increasingly critical, particularly in data centres and EV platforms. As data centres scale to meet rising demand from AI and digital infrastructure, compact and efficient power solutions are essential. Similarly, in EVs, higher power density contributes to lighter designs, improved efficiency, and extended driving range.

TI highlighted that the IsoShield innovation builds on its broader portfolio of power management solutions, including technologies such as MagPack™, with over 350 power modules designed for diverse applications.

The company also showcased its latest advancements at APEC 2026, including a high-performance 300kW silicon carbide (SiC) traction inverter reference design and an 800V to 6V DC/DC power distribution board. These solutions incorporate TI’s gallium nitride (GaN) power stages, digital isolators, and microcontrollers to support next-generation applications such as AI-driven data centres, automotive systems, robotics, and sustainable energy solutions.